Electronic grade phenolic resin is a high-end category of phenolic resin with special optimization of purity and performance. It's designed to meet the stringent requirements of reliability, heat resistance, and electrical performance for semiconductor packaging and high-end electronic composite materials.
The main product characteristics as below
High purity
The content of metal ions, halogens, and free phenols is extremely low. Prevent ion contamination and electromigration risks of impurities on chips from the source.
Excellent heat resistance and mechanical properties
After curing, it has a high glass transition temperature (Tg>150℃, up to 170℃ or above) and a low coefficient of thermal expansion (CTE), which can withstand the high-temperature reflow soldering process of lead-free solder (260℃+), effectively alleviate thermal stress, and prevent packaging cracking.
Reliable electrical insulation
The curing system has stable dielectric properties and can maintain good insulation resistance in high temperature and high humidity environments, meeting the requirements of integrated circuits for insulation reliability.
Application
High performance copper-clad laminate
As a curing agent/resin modifier, it is used to manufacture matrix resin systems for advanced packaging substrates or high heat resistant copper-clad laminates, meeting the stringent requirements of chip packaging for substrate size stability and heat resistance.
Epoxy molding compound
As a key curing agent component, it is used as a plastic encapsulation material for manufacturing semiconductor chips (discrete devices, integrated circuits).
Adhesives for electronic
As a curing agent for high-performance epoxy adhesives or potting materials, it is used in applications that require extremely high heat resistance and insulation reliability, such as power modules and automotive electronic controllers.
Package & Storage
Package
20kg or 25kg/bag.
Packed in woven bags with plastic film liners, or double-layered kraft paper bags with inner plastic film lining.
Storage
Must be stored in a cool, dry, and well-ventilated place. Protect from moisture and caking.
Keep away from heat sources.
FAQ
Q: How to use electronic grade phenolic resin in ceramic capacitors of special electronic components?
A: As an organic binder, it helps the ceramic powder to be formed, and can be completely decomposed without residual impurities during sintering, so as not to affect the capacitor performance.
Q: What are the special requirements for its purity standard?
A: The content of impurities (such as metal ions, chloride ions) should be controlled below ppm level, which is much higher than that of ordinary phenolic resin, so as to avoid affecting the performance of precision electronic components.
Q: What role can the process adaptability play when processing is added?
A: It can be formed by solution coating, molding, injection molding and other processes, and has good fluidity and high forming accuracy during processing.
Q: How does it bond to the common base materials in the electronic field?
A: It has strong bonding force on metal, ceramic, glass fiber and other substrates, and can be used as electronic adhesive or composite material matrix to improve the bonding stability of components.
Product Specification